Home » ThermalBuck to Exhibit at the Architecture and Design Event of The Year

ThermalBuck to Exhibit at the Architecture and Design Event of The Year

AIA Annual Convention in Philadelphia

The American Institute of Architects (AIA) is hosting their annual convention in the historic city of Philadelphia, May 19th -21st.

Billed as the architecture and design event of the year, attendees from all over the world will gather to attend workshops, seminars and events, and collaborate with experienced and emerging professionals in their field.

Some of the unusual and highly coveted experiences such as the tour of “Historic Boathouse Row” sold out early. But plenty of great workshops are tours still have spots available. First on our list is “The New Building Envelope”, featuring presenters Douglas Noble and Karen Kensek of the University of Southern California School of Architecture, and co-founders of the Facade Tectonics Institute. Also part of the presentation panel for this session are Mic Patterson and Jeffrey Vaglio, of Enclos, one of the largest specialty contractors in the US.

ThermalBuck joins nearly 800 exhibitors displaying the latest in products and technology. Please be our guest on the expo floor at AIA 2016, and view our wall displays in person to see exactly how ThermalBuck outperforms traditional wood bucks to build a better building envelope.  

Leave a Reply

Your email address will not be published. Required fields are marked *

This site uses Akismet to reduce spam. Learn how your comment data is processed.